Printed circuit board mounting structure and display apparatus including the same

ABSTRACT

A Printed Circuit Board (PCB) mounting structure having an improved structure for improving assemblability of a product, and a display apparatus including the PCB mounting structure. The PCB mounting structure includes a mounting member provided on the PCB and a mounting portion provided on a chassis for mounting the PCB to the chassis without using screws.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of U.S. patent application Ser. No.15/355,523, filed on Nov. 18, 2016, which claims the benefit of KoreanPatent Application No. 10-2015-0171975, filed on Dec. 4, 2015 in theKorean Intellectual Property Office, the disclosure of which isincorporated herein by reference.

BACKGROUND 1. Field

Embodiments of the present disclosure relate to a structure for mountinga Printed Circuit Board (PCB) used in an electrical device,particularly, a display apparatus, and more particularly, to a PCBmounting structure having an improved structure for improvingassemblability of a product, and a display apparatus including the PCBmounting structure.

2. Description of the Related Art

A display apparatus is a kind of output apparatus that convertselectrical information into visual information to display the visualinformation for users. The display apparatus includes a television, amonitor, and various kinds of portable terminals (for example, a smartphone, a tablet PC, and the like).

The display apparatus also includes a Cathode Ray Tube (CRT) display, aLight Emitting Diodes (LED) display, an Organic Light Emitting Diode(OLED) display, an Active-Matrix Organic Light Emitting Diode (AMOLED)display, a Liquid Crystal Display (LCD), and an Electronic Paper Display(EPD).

In order to couple the components of the display apparatus with eachother, screws are generally used. For example, the components of thedisplay apparatus include various kinds of panels and chassis. In thecase of coupling the components of the display apparatus using screws, aseparate fastening tool for fastening the screws is needed, which mayresult in an increase of manufacturing costs. Also, time for fasteningthe screws is required, which may result in an increase of manufacturingtime.

SUMMARY

Additional aspects and/or advantages will be set forth in part in thedescription which follows and, in part, will be apparent from thedescription, or may be learned by practice of the embodiments.

Therefore, it is an aspect of the present disclosure to provide aPrinted Circuit Board (PCB) mounting structure having an improvedstructure for easily mounting a PCB.

It is another aspect of the present disclosure to provide a displayapparatus having an improved structure for easily mounting a PCB.

Additional aspects of the disclosure will be set forth in part in thedescription which follows and, in part, will be obvious from thedescription, or may be learned by practice of the disclosure.

In accordance with an aspect of the present disclosure, there isprovided a Printed Circuit Board (PCB) mounting structure including: achassis on which a plurality of board resting portions are disposed; aPCB rested on the plurality of board resting portions; a mountingportion disposed on at least one board resting portion of the pluralityof board resting portions; and a mounting member fixed on the PCB, andremovably coupled with the mounting portion by sliding movement of thePCB.

The mounting member may include a coupling portion configured to beremovably coupled with the mounting portion. The mounting portion mayinclude an insertion hole into which the coupling portion is inserted sothat the coupling portion of the mounting member is accommodated in theinside of the mounting portion.

The coupling portion may include a pressing section configured to pressan area of the inner surface of the mounting portion if the couplingportion is inserted in the insertion hole.

The coupling portion may include a guide section configured tofacilitate insertion into the insertion hole.

The coupling portion may include a closing section configured to closethe insertion hole if the coupling portion is inserted in the insertionhole.

The mounting portion may include a thickness forming portion protrudingtoward the inside of the mounting portion in the area of the innersurface of the mounting portion, pressed by the pressing section.

The PCB may include an installation hole in which the mounting member isinstalled. The mounting member may include a support portion rested andsupported on the PCB, and a lead protruding from the support portion andinserted in the installation hole of the PCB. The mounting member mayinclude a conductive material, and at least one of the support portionand the lead is bonded on the PCB in such a way to be electricallyconnected to the PCB.

The support portion may include a first support section, and a secondsupport section protruding from the first support section toward thePCB. The mounting member may be supported by the second support sectionrested on the PCB.

The PCB may include a support portion accommodating groove configured toaccommodate the second support section. The mounting member may besupported by the first support section rested on the PCB.

The plurality of board resting portions may protrude from the chassistoward the PCB, and may be electrically connected to the chassis.

At least one board resting portion of the plurality of board restingportions may include a guide protrusion configured to guide a restingposition or a sliding direction of the PCB. The PCB may include a guidegroove to accommodate the guide protrusion.

At least one board resting portion of the plurality of board restingportions may include a stopper configured to prevent the PCB from movingwhen the PCB is mounted at a predetermined position. The PCB may includea stopper accommodating groove configured to accommodate the stopper.

The mounting portion may be bonded on the board resting portion in sucha way to be electrically connected to the board resting portion, or themounting portion is integrated into the board resting portion. Themounting portion may include a neck connected to the board restingportion, and a head connected to the neck and having a cross-sectionalarea that is wider than a cross-sectional area of the neck.

The PCB may include a first through hole through which the head of themounting portion passes, and a first guide hole which extends from thefirst through hole and along which the neck of the mounting portionslides, The mounting member may include a second through holecorresponding to the first through hole, and a second guide holecorresponding to the first guide hole.

The mounting member may include a support portion supported on the PCB,and a pressing portion extending from the support portion and configuredto press at least one of the head and the PCB. The second through holemay be formed in the support portion of the mounting member, and thesecond guide hole is formed in the pressing portion.

The pressing portion may include an arc structure protruding from thePCB. The second guide hole may extend from the second through hole tothe top portion of the arc structure. If the PCB is mounted, the headmay press the arc structure so that the pressing portion of the mountingmember presses the PCB.

The mounting portion may include a stopper protruding from the headtoward the PCB. The mounting member may include a stopper accommodatinggroove formed in the top portion of the arc structure.

In accordance with an aspect of the present disclosure, there isprovided a Printed Circuit Board (PCB) mounting structure including: achassis on which a PCB is mounted; and a mounting member rotatably fixedon the chassis, and configured to rotate to fix the PCB on the chassis.

The mounting member may include a coupling portion removably coupledwith the PCB, and a pressing portion configured to press the PCB towardthe chassis.

In accordance with an aspect of the present disclosure, there isprovided a display apparatus including: a display module; a chassisdisposed behind the display module to support the display module, andincluding a plurality of board resting portions; a Printed Circuit Board(PCB) rested on the plurality of board resting portions, and configuredto be electrically connected to the display module; a mounting portionformed in at least one board resting portion of the plurality of boardresting portions; and a mounting member fixed on the PCB, and removablycoupled with the mounting portion by sliding movement of the PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects of the disclosure will become apparent andmore readily appreciated from the following description of theembodiments, taken in conjunction with the accompanying drawings ofwhich:

FIG. 1 shows

FIG. 1 is a perspective view showing a display apparatus according to anembodiment of the present disclosure.

FIG. 2 shows a state in which a rear cover is separated from a chassis,in a display apparatus according to an embodiment of the presentdisclosure.

FIG. 3 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to an embodiment of the presentdisclosure.

FIG. 4 shows a state in which the PCB is rested on a board restingportion of the chassis, in the PCB mounting structure shown in FIG. 3.

FIG. 5 shows a state in which the PCB is mounted on the chassis, in thePCB mounting structure shown in FIG. 3.

FIG. 6 shows a state in which a mounting member is separated from thePCB, in the PCB mounting structure shown in FIG. 3.

FIG. 7 is a cross-sectional view showing an assembled state of amounting member and a mounting portion in the PCB mounting structureshown in FIG. 3.

FIG. 8 is a cross-sectional view showing an assembled state of amounting member and a mounting portion in the PCB mounting structureshown in FIG. 3.

FIG. 9 is a cross-sectional view showing an assembled state of amounting member and a mounting portion in the PCB mounting structureshown in FIG. 3.

FIG. 10 shows a state in which a mounting member is separated from aPCB, in a PCB mounting structure according to another embodiment of thepresent disclosure.

FIG. 11 shows a state in which a mounting member is separated from aPCB, in a PCB mounting structure according to another embodiment of thepresent disclosure.

FIG. 12 shows an assembled state of the mounting member and a mountingportion, in the PCB mounting structure shown in FIG. 10.

FIG. 13 is a cross-sectional view showing an assembled state of themounting member and a mounting portion in the PCB mounting structureshown in FIG. 11.

FIG. 14 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure.

FIG. 15 shows a state in which the PCB is mounted on the chassis, in thePCB mounting structure shown in FIG. 14.

FIG. 16 is a cross-sectional view showing an assembled state of the PCBand the chassis, in the PCB mounting structure shown in FIG. 14.

FIG. 17 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure.

FIG. 18 shows a state in which the PCB is rested on a board restingportion of the chassis, in the PCB coupling structure shown in FIG. 17.

FIG. 19 shows a state in which the PCB is mounted on the chassis, in thePCB mounting structure shown in FIG. 17.

FIG. 20 shows a state in which the PCB is separated from a mountingmember, in the PCB mounting structure shown in FIG. 17.

FIG. 21 is a cross-sectional view showing an assembled state of themounting member and a mounting portion, in the PCB mounting structureshown in FIG. 17.

FIG. 22 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure.

FIG. 23 shows a state in which the PCB is rested on a board restingportion of the chassis, in the PCB mounting structure shown in FIG. 22.

FIG. 24 shows a state in which the PCB is mounted on the chassis, in thePCB mounting structure shown in FIG. 22.

FIG. 25 is a side view showing an assembled state of the PCB and thechassis, in the PCB mounting structure of FIG. 22.

FIG. 26 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure.

FIG. 27 shows a state in which the PCB is rested on a board restingportion of the chassis, in the PCB mounting structure shown in FIG. 26.

FIG. 28 shows a state in which the PCB is mounted on the chassis, in thePCB mounting structure shown in FIG. 26.

FIG. 29 shows a state in which the PCB is separated from a mountingmember, in the PCB mounting structure shown in FIG. 26.

FIG. 30 is a cross-sectional view showing an assembled state of themounting member and the mounting portion, in the PCB mounting structureshown in FIG. 26.

FIG. 31 is an enlarged view of two types of mounting portions of thechassis, in the PCB mounting structure shown in FIG. 26.

FIG. 32 is an enlarged view of two types of mounting portions of thechassis, in the PCB mounting structure shown in FIG. 26.

DETAILED DESCRIPTION

Reference will now be made in detail to the embodiments, examples ofwhich are illustrated in the accompanying drawings, wherein likereference numerals refer to the like elements throughout. Theembodiments are described below by referring to the figures.

Configurations illustrated in the embodiments and the drawings describedin the present specification are only the preferred embodiments of thepresent disclosure, and thus it is to be understood that variousmodified examples, which may replace the embodiments and the drawingsdescribed in the present specification, are possible when filing thepresent application.

Also, like reference numerals or symbols used in the drawings of thepresent specification represent members or components performing thesubstantially same functions.

Also, the terms used in the present specification are used to describethe embodiments of the present disclosure. Accordingly, it should beapparent to those skilled in the art that the following description ofexemplary embodiments is provided for illustration purpose only and notfor the purpose of limiting the embodiments as defined by the appendedclaims and their equivalents. It is to be understood that the singularforms “a,” “an,” and “the” include plural referents unless the contextclearly dictates otherwise. In this specification, it will be understoodthat when the terms “includes,” “comprises,” “including,” and/or“comprising,” when used in this specification, specify the presence ofstated features, figures, steps, components, or combination thereof, butdo not preclude the presence or addition of one or more other features,figures, steps, components, members, or combinations thereof.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various components, these components shouldnot be limited by these terms. These terms are only used to distinguishone component from another. For example, a first component could betermed a second component, and, similarly, a second component could betermed a first component, without departing from the scope of thepresent disclosure. As used herein, the term “and/or” includes any andall combinations of one or more of associated listed items.

Also, the terms “front end”, “rear end”, “upper portion”, “lowerportion”, “upper end”, and “lower end”, when used in this specification,are defined based on the drawings, and the shapes and locations of thecorresponding components are not limited by the terms.

Hereinafter, the embodiments of the present disclosure will be describedin detail with reference to the accompanying drawings. Hereinafter, aflat panel display apparatus will be described as an embodiment of thepresent disclosure, however, the present disclosure may also be appliedto a curved display apparatus and a bendable or flexible displayapparatus that can change its shape between a curved shape and a flatshape.

Also, the present disclosure can be applied to all kinds of electronicproducts in which a Printed Circuit Board (PCB) is used, as well as adisplay apparatus.

FIG. 1 is a perspective view showing a display apparatus according to anembodiment of the present disclosure, and FIG. 2 shows a state in whicha rear cover is separated from a chassis, in a display apparatusaccording to an embodiment of the present disclosure.

As shown in FIG. 1, a display apparatus 1 may include a display module10 that is in the shape of a flat plate, and a front cover 20 formingthe front edges and side appearance of the display apparatus 1.

Also, as shown in FIG. 2, the display apparatus 1 may include a chassis40 supporting the display module 10, and a rear cover 30 forming therear appearance of the display apparatus 1.

The display module 10 may include a display panel on which images aredisplayed, and a backlight unit. The backlight unit may include opticalmembers, such as a light source and a light guide plate. That is, thedisplay module 10 may include, as an edge type backlight unit, a lightsource disposed behind the display panel, and a light guide plateconfigured to guide light emitted from the light source to the displaypanel. The light guide plate may convert light emitted from the lightsource into surface light, and then cause the surface light to bedirected toward the display panel.

The backlight unit may further include an optical member such as a sheetmember. The sheet member may include an optical sheet having opticalproperties, and a Quantum Dot (QD) sheet provided to improve colorreproduction.

The chassis 40 may be disposed to support the display module 10. Thechassis 40 may include a first chassis (not shown), and a second chassis40 disposed behind the first chassis. In other words, the first chassismay be disposed on at least one of the front part or sides of thedisplay module 10. For example, the first chassis may be disposed tocover a part of the front surface of the display module 10. Or, thefirst chassis may be disposed to cover the side surfaces of the displaymodule 10. Or, the first chassis may be disposed to cover a part of thefront surface of the display module 10 and the sides of the displaymodule 10. The second chassis 40 may be disposed on at least one of thefront part or sides of the display module 10. Preferably, the secondchassis 40 may be disposed behind the display module 10. Morespecifically, if the first chassis is disposed to cover a part of thefront surface of the display module 10, the second chassis 40 may bedisposed to cover the sides and rear part of the display module 10. Ifthe first chassis is disposed to cover the sides of the display module10, the second chassis 40 may be disposed behind the display module 10.If the first chassis is disposed to cover a part of the front surface ofthe display module 10 and the sides of the display module 10, the secondchassis 40 may be disposed behind the display module 10. The firstchassis may be coupled with the second chassis 40 to support the displaymodule 10. Also, the first chassis and the second chassis 40 may beintegrated into one body to support the display module 10.

The rear cover 30 may be disposed behind the second chassis 40 to facethe second chassis 40. The rear cover 30 may be disposed behind thesecond chassis 40 to cover at least one part of the second chassis 40.The rear cover 30 may be removably coupled with the second chassis 40.

The display apparatus 1 may include at least one PCB 50 electricallyconnected to the display module 10. Referring to FIG. 2, the at leastone PCB 50 may be mounted on the chassis 40.

The at least one PCB 50 may include a power board, a signal processingboard, a driving board, etc. More specifically, the power board mayinclude a circuit device to supply power to the display module 10. Thesignal processing board may include a circuit device to receive andprocess external signals. The driving board may drive the display module10. The power board, the signal processing board, and the driving boardmay be disposed independently or agglomerate.

Hereinafter, a structure in which the PCB 50 is mounted on the chassis40 will be described with reference to the drawings.

FIG. 3 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to an embodiment of the presentdisclosure, FIG. 4 shows a state in which the PCB is rested on a boardresting portion of the chassis, in the PCB mounting structure shown inFIG. 3, FIG. 5 shows a state in which the PCB is mounted on the chassis,in the PCB mounting structure shown in FIG. 3, and FIG. 6 shows a statein which a mounting member is separated from the PCB, in the PCBmounting structure shown in FIG. 3.

Referring to FIGS. 3, 4, and 5, the chassis 40 may include a boardresting portion 60 on which the PCB 50 is rested. The chassis 40 and theboard resting portion 60 may be formed of a conductive material so thatthe PCB 50 can be grounded to the chassis 40. The board resting portion60 may be integrated into the chassis 40, or formed separately from thechassis 40 and then bonded with the chassis 40 in such a way to beelectrically connected to the chassis 40. A method of bonding the boardresting porting 60 with the chassis 40 in such a way to be electricallyconnected to the chassis 40 may include welding, adhesion using aconductive adhesive, etc.

The board resting portion 60 may protrude from the chassis 40, and theremay be a plurality of board resting portions 60. The top surface 61 ofthe board resting portion 60 may be flat so that a PCB being a flatplate type can be rested on the board resting portion 60. In a curveddisplay apparatus using a curved chassis, a curved PCB, etc., the topsurface 61 of the board resting portion 60 may also be curved, althoughnot shown in the drawings. Since the PCB 50 is rested on the boardresting portion 60 protruding from the chassis 40, space may be formedbetween the PCB 50 and the chassis 40, thereby preventing circuitdevices mounted on the PCB 50 from being damaged.

The PCB 50 may be rested on the nest or board resting portion 60, andthen slide to be mounted on the chassis 40. In order to the PCB 50 to beeasily mounted on the board resting portion 60, a guide protrusion 161for guiding a resting position or a sliding direction of the PCB 50 maybe formed on the top surface 61 of the board resting portion 60.

The PCB 50 may be rested on the board resting portion 60 such that theguide protrusion 161 is accommodated in a guide groove 141 formed in thePCB 50, and then, the PCB 50 may slide such that the guide protrusion161 moves along the guide groove 141 that is in the shape of a longhole.

Preferably, the PCB 50 may include two or more guide grooves 141. If thePCB 50 is a rectangular flat plate, the guide grooves 141 may berespectively formed in two opposite corners of the PCB 50. Morepreferably, the guide grooves 141 may be respectively formed in twodiagonal corners of the PCB 50.

If the PCB 50 is rested on the board resting portion 60 and then slides,the PCB 50 may be mounted on the chassis 40 by a mounting member 100provided in the PCB 50. The mounting member 100 may be fixed on the PCB50, and removably coupled with a mounting portion 120 formed in at leastone of the board resting portion 60.

In the inside of the board resting portion 60, a cavity may be formed.The mounting portion 120 formed in the at least one board restingportion 60 may include an insertion hole 121 formed in the inclinedsurface 62 of the board resting portion 60. A spring or coupling portion110 of the mounting member 100, which is inserted into the insertionhole 121 of the mounting portion 120, may be accommodated in the insideof the mounting portion 120, that is, the cavity of the board restingportion 60 to thus elastically support or push against an area of theinner surface of the board resting portion 60.

Referring to FIG. 6, the PCB 50 may include an installation hole 143 inwhich the mounting member 100 is installed. The mounting member 100 mayinclude a support portion 101 rested and supported on the PCB 50, and alead 102 protruding from the support portion 101 and inserted into theinstallation hole 143 of the PCB 50.

The mounting member 100 may include a conductive material, and at leastone of the support portion 101 and the lead 102 may be bonded with thePCB 50 by a conductive material so as to be electrically connected tothe PCB 50.

The PCB 50 may include a through hole 144 through which the couplingportion 110 of the mounting member 100 can pass. The support portion 101of the mounting member 100 may be supported on one surface of the PCB50, and the coupling portion 110 protruding from the support portion 101may pass through the through hole 144 formed in the PCB 50 to protrudefrom the other surface of the PCB 50.

The coupling portion 110 of the mounting member 100 may include a firstpart 111 extending vertically from the support portion 101, and a secondpart 112 extending from the first part 111 and inserted in the insertionhole 121 of the mounting portion 120.

The second part 112 of the coupling portion 110 of the mounting member100 may include a guide section 113 to facilitate insertion into theinsertion hole 121, and a spring or a pressing section 114 to press anarea of the inner surface of the mounting portion 120 when the secondpart 112 is inserted in the insertion hole 121. The pressing section 114may extend from the first part 111 such that the second part 112 of thecoupling portion 110 is inclined toward the support portion 101, and theguide section 113 may extend from the end of the pressing section 114such that the second part 112 is inclined toward a direction that is faraway from the support portion 101.

The guide section 113 of the coupling portion 110 may extend to apredetermined length to guide the coupling portion 110 to be easilyinserted in the insertion hole 121, even when the PCB 50 is not keptclose to the board resting portion 60 due to any deformation although itis rested on the board resting portion 60.

Since foreign materials such as dust may enter the inside of the chassis40 through the insertion hole 121 formed in the mounting portion 120,the first part 111 of the coupling portion 110 of the mounting member100 may include a closing section 115 for closing the insertion hole121. More specifically, the coupling portion 110 of the mounting member100 may be formed with a width corresponding to that of the insertionhole 121 of the mounting portion 120, so that the closing section 115 ofthe first part 111 of the coupling portion 110 can close the insertionhole 121 when the coupling portion 110 is inserted in the insertion hole121.

A chamfer 116 may be formed at the end of the guide section 113, so thatthe coupling portion 110 can be easily inserted into the insertion hole121 by the guide section 113 although the coupling portion 110 is formedto correspond to the width of the insertion hole 121.

Referring to FIGS. 3 to 6, if the PCB 50 slides so that the couplingportion 110 of the mounting member 100 is completely inserted in theinsertion hole 121 of the mounting portion 120, the PCB 50 may bemounted on the chassis 40. A stopper 162 may be formed on the at leastone board resting portion 60, in order to prevent the PCB 50 mounted ata predetermined position on the chassis 40 from escaping from thechassis 40.

The stopper 162 may protrude from the top surface 61 of the boardresting portion 60, like the guide protrusion 161, and the PCB 50 mayinclude a stopper accommodating groove 142. If the stopper 162 isinserted in the stopper accommodating groove 142, the stopper 162 cannotmove in the stopper accommodating groove 142, unlike the guide groove141.

The stopper 162 and the guide protrusion 161 may be formed on the topsurface 61 of the same board resting portion 60, and in this case, theguide groove 141 and the stopper accommodating groove 142 may be thesame groove. That is, if the guide protrusion 161 moves from one end tothe other end of the guide groove 141 by the sliding movement of the PCB50, the stopper 162 may be accommodated in the one end of the guidegroove 141 and supported.

Although not shown in the drawings, the mounting portion 120 may also bedisposed on the top surface 61 of the same board resting portion 60 onwhich the stopper 162 and/or the guide protrusion 161 is formed.

As shown in FIG. 2, when the PCB 50 is mounted on the chassis 40 in adirection that is vertical to the ground in an electronic product suchas the display apparatus 1, the PCB 50 may be mounted on the chassis 40by sliding in a down direction in consideration of gravity.

In the PCB mounting structure according to an embodiment of the presentdisclosure, it is possible to change the design of the mounting portion120 such that the mounting member 100 can be applied to all of thechassis 40 or the board resting portion 60 formed of materials havingvarious thicknesses and the PCB 50 having various thicknesses.

FIGS. 7, 8, and 9 are cross-sectional views showing an assembled stateof a mounting member and a mounting portion in the PCB mountingstructure shown in FIG. 3.

FIG. 7 shows an assembled state of the mounting member 100 and themounting portion 120 when the designs of the mounting member 100 and themounting portion 120 do not change. A minimum distance A between thesupport portion 101 and the coupling portion 110 of the mounting member100, that is, a distance A between the support portion 101 and the uppersurface of the pressing section 114 when the coupling portion 110 of themounting member 100 is not inserted in the insertion hole 121 of themounting portion 120 may be smaller than a sum of the thickness B of thetop portion of the board resting portion 60 on which the mountingportion 120 is disposed and the thickness C of the PCB 50.

Accordingly, when the mounting member 100 is coupled with the mountingportion 120, the coupling portion 110 of the mounting member 100 may beelastically deformed so that the pressing section 114 presses an area ofthe inner surface of the mounting portion 120 by a restoring force togenerate a clamping force of the mounting member 100. Also, due tocontact of the mounting member 100 with the mounting portion 120,Electro Magnetic Interference (EMI) grounding between the PCB 50 and thechassis 40 is possible.

FIG. 8 shows the mounting portion 120 subjected to a change of designsuch that the mounting member 100 of FIG. 7 can be applied in the samemanner to the mounting portion 120, when the thickness D of the boardresting portion 60 is thinner than the thickness B of the board restingportion 60 of FIG. 7.

Since the minimum distance A between the support portion 101 and thecoupling portion 110 of the mounting member 100 and the thickness C ofthe PCB 50 are the same as in the embodiment of FIG. 7, a thickness Ecorresponding to a difference between the thickness B of the boardresting portion 60 of FIG. 7 and the thickness D of the board restingportion 60 of FIG. 8 may need to be compensated, in order to generatethe same fastening force as in the embodiment of FIG. 7 between themounting member 100 and the mounting portion 120 of FIG. 8.

Accordingly, the mounting portion 120 may include a thickness formingportion 122, in the area of the inner surface of the mounting portion120, pressed by the pressing section 114 of the mounting member 100,wherein the thickness forming portion 122 may protrude toward the insideof the mounting portion 120. That is, in the top portion of the boardresting portion 60, the thickness forming portion 122 may be formed insuch a way to protrude toward the inside of the board resting portion 60by the thickness E corresponding to the difference between the thicknessB of the board resting portion 60 of FIG. 7 and the thickness D of theboard resting portion 60 of FIG. 8.

The thickness forming portion 122 formed in the mounting portion 120 maybe applied to the PCB 50 having a thin thickness.

FIG. 9 shows the mounting portion 120 subjected to a change of designsuch that the mounting member 100 of FIG. 7 can be applied in the samemanner to the mounting portion 120 when the thickness of the PCB 50 isthinner than the thickness C of the PCB 50 of FIG. 7.

Since the minimum distance A between the support portion 101 and thecoupling portion 110 of the mounting member 100 and the thickness B ofthe top portion of the mounting portion 120 are the same as in theembodiment of FIG. 7, a thickness F (C−G=F) corresponding to adifference between the thickness C of the PCB 50 of FIG. 7 and thethickness G of the PCB 50 of FIG. 9 may need to be compensated, in orderto generate the same fastening force as in the embodiment of FIG. 7between the mounting member 100 and the mounting portion 120 of FIG. 9.

Accordingly, like the embodiment of FIG. 8, the mounting portion 120 ofFIG. 9 may include a thickness forming portion 122, in the area of theinner surface of the mounting portion 120, pressed by the pressingsection 114 of the mounting member 100, wherein the thickness formingportion 122 may protrude toward the inside of the mounting portion 120.

In the PCB mounting structure according to another embodiment of thepresent disclosure, it is possible to change the designs of the mountingmember 100 and the PCB 50 such that the mounting member 100 can beapplied to all of the chassis 40 or the board resting portion 60 formedof materials having various thicknesses and the PCB 50 having variousthicknesses.

FIG. 10 shows a state in which a mounting member is separated from aPCB, in a PCB mounting structure according to another embodiment of thepresent disclosure, FIG. 11 shows a state in which a mounting member isseparated from a PCB, in a PCB mounting structure according to anotherembodiment of the present disclosure, FIG. 12 shows an assembled stateof the mounting member and a mounting portion, in the PCB mountingstructure shown in FIG. 10, and FIG. 13 is a cross-sectional viewshowing an assembled state of the mounting member and a mounting portionin the PCB mounting structure shown in FIG. 11.

Referring to FIGS. 10 to 13, the support portion 101 of the mountingmember 100 may have a two-step structure. More specifically, the supportportion 101 of the mounting member 100 may include a first supportsection 103, and a second support section 104 protruding toward the PCB50 from the first support section 103.

The thickness H of the PCB 50 shown in FIG. 10 may be thinner than thethickness I of the PCB 50 shown in FIG. 11, and accordingly, the secondsupport section 104 protruding to a height J corresponding to adifference between the thickness H of the PCB 50 of FIG. 12 and thethickness I of the PCB 50 of FIG. 13 may be supported on the PCB 50 soas to compensate for the thickness difference J.

Also, since the PCB 50 of FIG. 11 is thicker than the PCB 50 of FIG. 10,the protruding second support section 104 of the support portion 101 ofthe mounting member 100 may be accommodated in a support portionaccommodating groove 145 formed in the PCB 50, so that the mountingmember 100 can be supported on the PCB 50 by the second support section104.

Referring to FIGS. 12 and 13, since the mounting member 100 includes thefirst support section 103 and the second support section 104, a minimumdistance K between the PCB 50 and the coupling portion 110 of themounting member 100 can be maintained although the thickness of the PCB50 changes. If a distance L between the top surface 61 of the boardresting portion 60 and the inner surface of the board resting portion 60on which the coupling portion 110 is supported is constant although thethickness of the PCB 50 changes, the same fastening force can begenerated between the mounting member 100 and the mounting portion 120.

Hereinafter, a PCB mounting structure according to another embodiment ofthe present disclosure will be described with reference to FIGS. 14, 15,and 16.

FIG. 14 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure, FIG. 15 shows a state in which the PCB is mounted on thechassis, in the PCB mounting structure shown in FIG. 14, and FIG. 16 isa cross-sectional view showing an assembled state of the PCB and thechassis, in the PCB mounting structure shown in FIG. 14.

Referring to FIGS. 14, 15, and 16, the chassis 40 may include a mountingmember 200 that can be coupled with the PCB 50 by a snap button method.The PCB 50 may include a through hole 241 through which the mountingmember 200 can be coupled. The mounting member 200 may include a supportportion 201 bonded on the chassis 40, and a coupling portion 210, havingopposing spring member which extends from the support portion 201 andwhich can be inserted in the through hole 241 of the PCB 50.

The support portion 201 of the mounting member 200 may include a lowersurface 202 bonded on the chassis 40, and an upper surface 204 spaced bya predetermined distance from the lower surface 202 with a side surface203 in between, wherein the PCB 50 is rested on the upper surface 204.The mounting member 200 may include a conductive material, and the lowersurface 202 of the support portion 201 may be bonded with the chassis 40in such a way to be electrically connected to the chassis 40.

The coupling portion 210 of the mounting member 200 may protrude fromthe upper surface 204 of the support portion 201, and include a firstcoupling section 211 and a second coupling section 212 that aresymmetrical to each other. The first coupling section 211 and the secondcoupling section 212 may be spaced from each other to correspond to thewidth M of the through hole 241, and each of the first coupling section211 and the second coupling section 212 may include a first part 213extending from the upper surface 204 of the support portion 201 by alength corresponding to the thickness of the PCB 50.

Also, each of the first coupling section 211 and the second couplingsection 212 may include a second part 214 extending from the first part213 in such a way to be inclined with respect to the first part 213 sothat the distance between the first coupling section 211 and the secondcoupling section 212 can become wider than the width M of the throughhole 241.

Also, each of the first coupling section 211 and the second couplingsection 212 may include a third part 215 extending from the second part214 in such a way to be inclined with respect to the second part 214 sothat the distance between the first coupling section 211 and the secondcoupling section 212 can become narrower than the width M of the throughhole 241.

A distance N between the end of the third part 215 of the first couplingsection 211 and the end of the third part 215 of the second couplingsection 212 may be wider than a sum of the horizontal lengths P of thesecond parts 214, so that the coupling portion 210 of the mountingmember 200 can be easily inserted into the through hole 241 of the PCB50 by the elastic deformation.

If the coupling portion 210 of the mounting member 200 is inserted intothe through hole 241 of the PCB 50, the mounting member 200 can beprevented from escaping from the through hole 241 of the PCB 50 by theupper surface 204 of the support portion 201, and the first and secondparts 213 and 214 of the coupling portion 210.

Also, when the PCB 50 is detached from the chassis 40, the third parts215 of the mounting member 200 may be pressed toward the center of thefirst coupling section 211 and the second coupling section 212 so thatthe PCB 50 can be easily decoupled with the chassis 40 by the elasticdeformation of the coupling portion 210.

Hereinafter, a PCB mounting structure according to another embodiment ofthe present disclosure will be described with reference to FIGS. 17 to21.

FIG. 17 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure, FIG. 18 shows a state in which the PCB is rested on a boardresting portion of the chassis, in the PCB coupling structure shown inFIG. 17, and FIG. 19 shows a state in which the PCB is mounted on thechassis, in the PCB mounting structure shown in FIG. 17. Also, FIG. 20shows a state in which the PCB is separated from a mounting member, inthe PCB mounting structure shown in FIG. 17, and FIG. 21 is across-sectional view showing an assembled state of the mounting memberand a mounting portion, in the PCB mounting structure shown in FIG. 17.

Referring to FIGS. 17, 18, and 19, the chassis 40 may include the boardresting portion 60 on which the PCB 50 is rested. The board restingportion 60 may have the same shape and function as those of the boardresting portion 60 shown in FIGS. 3, 4, and 5.

Like the embodiment shown in FIGS. 3, 4, and 5, the PCB 50 may be restedon the board resting portion 60 and then slide to be mounted on thechassis 40, however, unlike the embodiment shown in FIGS. 3, 4, and 5,the board resting portion 60 shown in FIGS. 17, 18, and 19 may includeno guide protrusion, and a mounting portion 320 protruding from theboard resting portion 60 may function as a guide protrusion.

If the PCB 50 is rested on the board resting portion 60 and then slides,the PCB 50 may be mounted on the chassis 40 by a mounting member 300provided on the PCB 50. The mounting member 300 may be fixed on the PCB50, and removably coupled with the mounting portion 320 formed on atleast one of the board resting portion 60.

More specifically, the mounting portion 320 formed on the board restingportion 60 may include a neck 321 (see FIG. 21) connected to the topsurface 61 of the board resting portion 60, and a head 322 (see FIG. 21)connected to the neck 321 and having a cross-sectional area that iswider than the cross-sectional area of the neck 321. The neck 321 may beformed in the shape of a cylinder, and the head 322 may be formed in theshape of a disk. The mounting portion 320 may be bonded on the boardresting portion 60 in such a way to be electrically connected to theboard resting portion 60, or may be integrated into the board restingportion 60.

Referring to FIG. 20, the PCB 50 may include a mounting hole 343 inwhich the mounting member 300 can be installed. The mounting member 300may include a support portion 301 rested and supported on the PCB 50,and a lead 302 which protrudes from the support portion 301 and can beinserted into the mounting hole 343 of the PCB 50.

The mounting member 300 may include a conductive material, and at leastone of the support portion 301 and the lead 302 may be bonded on the PCB50 by the conductive material so that the mounting member 300 can beelectrically connected to the PCB 50.

The PCB 50 may include a first through hole 344 through which the head322 of the mounting portion 320 can pass, and a first guide hole 345which extends from the first through hole 344 and along which the neck321 of the mounting portion 320 can slide.

The mounting member 300 may include a second through hole 304corresponding to the first through hole 344 of the PCB 50, and a secondguide hole 305 corresponding to the first guide hole 345 of the PCB 50.The second through hole 304 may be formed in the support portion 301 ofthe mounting member 300, and the second guide hole 305 may be formed ina pressing portion 310 of the mounting member 300.

Referring to FIG. 21, the pressing portion 310 may extend from thesupport portion 301, and may press the head 322 of the mounting portion320 if the PCB 50 is mounted. That is, the pressing portion 310 may beinclined upward along a direction in which the second guide hole 305extends from the second through hole 304. If the PCB 50 is rested on theboard resting portion 60 and then slides, the pressing portion 310 ofthe mounting member 300 may be elastically deformed by the head 322 ofthe mounting portion 320, so that the end of the pressing portion 310can press the lower surface of the head 322 of the mounting portion 320.

Hereinafter, a PCB mounting structure according to another embodiment ofthe present disclosure will be described with reference to FIGS. 22 and25.

FIG. 22 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure, FIG. 23 shows a state in which the PCB is rested on a boardresting portion of the chassis, in the PCB mounting structure shown inFIG. 22, FIG. 24 shows a state in which the PCB is mounted on thechassis, in the PCB mounting structure shown in FIG. 22, and FIG. 25 isa side view showing an assembled state of the PCB and the chassis, inthe PCB mounting structure of FIG. 22.

Referring to FIGS. 22 and 25, the chassis 40 may include the boardresting portion 60 on which the PCB 50 is rested. The board restingportion 60 may have the same shape and function as those of the boardresting portion 60 shown in FIGS. 3, 4, and 5.

The PCB 50 may be rested on the board resting portion 60, and thenmounted on the chassis 40 by rotation of a mounting member 400. In orderfor the PCB 50 to be easily mounted on the board resting portion 60, aguide protrusion 461 for guiding a resting position of the PCB 50 may beformed on the top surface 61 of the board resting portion 60.

The PCB 50 may include a guide groove 441 to accommodate the guideprotrusion 461, and a coupling groove 442 that can be coupled with themounting member 400. If the PCB 50 is a rectangular flat plate, theguide groove 441 may be formed in each of the corners of the PCB 50, anda first coupling groove 443 and a second coupling groove 444 may berespectively formed at two edges forming each corner.

The chassis 40 may include an installation portion 462 which is disposedadjacent to each corner of the PCB 50 and with which the mounting member400 can be rotatably coupled. The installation portion 462 may include astopper 463 configured to prevent the mounting member 400 from rotatingfrom a released position to a mounting position when no external forceis applied.

The mounting member 400 may include a coupling portion 410 removablycoupled with the coupling groove 442 of the PCB 50, and a pressingportion 413 to press the PCB 50 toward the chassis 40. The mountingmember 400 may be formed of a linear material having elasticity, and thecoupling portion 410 may include a first coupling section 411 and asecond coupling section 412 that can be respectively coupled with thefirst coupling groove 443 and the second coupling groove 444. Thepressing portion 413 may be formed between the first coupling section411 and the second coupling section 412 to press the corner of the PCB50.

The distance between the first coupling section 411 and the secondcoupling section 412 may be shorter than the shortest distance betweenthe first coupling groove 443 and the second coupling groove 444 of thePCB 50 so that the coupling portion 410 can elastically support thecoupling groove 442 when the mounting member 400 is at the mountingposition. The pressing portion 413 may contact the PCB 50 before thecoupling portion 410 is coupled with the coupling groove 442, and whenthe coupling portion 410 is fixed at the coupling groove 442, thepressing portion 413 may press the PCB 50.

Referring to FIG. 25, since an angle Q between the pressing portion 413and the coupling portion 410 when the mounting member 400 is at themounting position is greater than an angle R between the pressingportion 413 and the coupling portion 410 when the mounting member 400 isat the released position, due to elastic deformation, the pressingportion 413 can elastically support the PCB 50.

Hereinafter, a PCB mounting structure according to another embodiment ofthe present disclosure will be described with reference to FIGS. 26 to32.

FIG. 26 shows a state in which a PCB is separated from a chassis, in aPCB mounting structure according to another embodiment of the presentdisclosure, FIG. 27 shows a state in which the PCB is rested on a boardresting portion of the chassis, in the PCB mounting structure shown inFIG. 26, FIG. 28 shows a state in which the PCB is mounted on thechassis, in the PCB mounting structure shown in FIG. 26, and FIG. 29shows a state in which the PCB is separated from a mounting member, inthe PCB mounting structure shown in FIG. 26.

Referring to FIGS. 26 to 29, the chassis 40 may include the boardresting portion 60 on which the PCB 50 is rested or rests. The boardresting portion 60 may have the same shape and function as those of theboard resting portion 60 shown in FIGS. 3, 4, and 5.

Like the embodiment shown in FIGS. 3, 4, and 5, the PCB 50 may be restedon the board resting portion 60 and then slide to be mounted on thechassis 40, and unlike the embodiment shown in FIGS. 3, 4, and 5, theboard resting portion 60 shown in FIGS. 26 to 32 may include no guideprotrusion, and a mounting portion 520 protruding from the board restingportion 60 may function as a guide protrusion.

If the PCB 50 is rested on the board resting portion 60 and then slides,the PCB 50 may be mounted on the chassis 40 by a mounting member 500provided on the PCB 50. The mounting member 500 may be fixed on the PCB50, and removably coupled with a mounting portion 520 formed in at leastone of the board resting portion 60.

More specifically, the mounting portion 520 formed in the board restingportion 60 may include a neck 521 connected to the top surface 61 of theboard resting portion 60, and a head 522 connected to the neck 521 andhaving a cross-sectional area that is wider than a cross-sectional areaof the neck 521. The neck 521 may be in the shape of a plate memberhaving a narrow width, and the head 522 may be in the shape of a platemember having a wider width than the neck 521. The mounting portion 520may be bonded on the board resting portion 60 in such a way to beelectrically connected to the board resting portion 60, or may beintegrated into the board resting portion 60.

Referring to FIG. 29, the PCB 50 may include an installation hole 543 inwhich the mounting member 500 can be installed. The mounting member 500may include a support portion 501 rested and supported on the PCB 50,and a lead 502 protruding from the support portion 501 and inserted intothe installation hole 543 of the PCB 50.

The mounting member 500 may include a conductive material, and at leastone of the support portion 501 and the lead 502 may be bonded on the PCB50 by the conductive material in such a way to be electrically connectedto the PCB 50.

The PCB 50 may include a first through hole 544 through which the head522 of the mounting portion 520 can pass, and a first guide hole 545which extends from the first through hole 544 and along which the neck521 of the mounting portion 520 can slide.

The mounting member 500 may include a second through hole 504corresponding to the first through hole 544 of the PCB 50, and a secondguide hole 505 corresponding to the first guide hole 545 of the PCB 50.The second through hole 504 may be formed in the support portion 501 ofthe mounting member 500, and the second guide hole 505 may be formed inthe pressing portion 510 of the mounting member 500.

FIG. 30 is a cross-sectional view showing an assembled state of themounting member and the mounting portion, in the PCB mounting structureshown in FIG. 26, and FIGS. 31 and 32 are enlarged views of two types ofmounting portions of the chassis, in the PCB mounting structure shown inFIG. 26.

Referring to FIG. 30, the pressing portion 510 may extend from thesupport portion 501, and press the head 522 of the mounting portion 520if the PCB 50 is mounted. That is, the pressing portion 510 may includean arc structure 511 protruding from the PCB 50, and the second guidehole 505 may extend from the second through hole 504 to the top of thearc structure 511.

If the PCB 50 is rested on the board resting portion 60 and then slides,the head 522 of the mounting portion 520 may press the arc structure 511of the pressing portion 510 to elastically deform the pressing portion510, so that the end of the pressing portion 510 can press the PCB 50.

Referring to FIGS. 26 to 28 and FIGS. 31 and 32, the mounting portion520 may include a stopper 523, in order to prevent the PCB 50 slidingand rested at a predetermined position on the chassis 40 from escapingfrom the chassis 40.

The stopper 523 may protrude from the head 522 toward the PCB 50, andthe mounting member 500 may include a stopper accommodating groove 506.The stopper accommodating groove 506 may be formed in the top portion ofthe arc structure 511 of the pressing portion 510, at which the secondguide hole 505 of the mounting member 100 ends.

If or when a plurality of mounting portions 520 are formed, the stopper523 may be formed in at least one of the mounting portions 520. As shownin FIGS. 26, 27, and 28, if the stopper 523 is formed in one of themounting portions 520, the PCB 40 can be easily separated from thechassis 40 by pressing the pressing portion 510 of the mounting portion520 to separate the stopper 523 from the stopper accommodating groove506.

The PCB mounting structures as described above can be used in thedisplay apparatus 1. Also, the PCB mounting structures can be applied toall kinds of electronic products in which a PCB is used. Further, thePCB mounting structures can be modified that a plurality of restingportions are disposed on a PCB and a mounting member is fixed on achassis.

Since the PCB slides to be assembled with the chassis using the mountingmember provided on the PCB, screws used in typical PCB assemblingprocesses are not needed, resulting in reduction of manufacturing costsand manufacturing time.

Particularly, since the mounting member capable of being slidinglycoupled, instead of screws, is used in a process of assembling thedisplay apparatus, the thickness of the display apparatus can bedesigned without considering the lengths of screw threads, which maycontribute to a slim design of the display apparatus.

Also, since no separate tool for mounting the PCB is needed, the PCB canbe easily mounted, and also can be easily removed or replaced formaintenance.

The present disclosure also to provides a system including a chassishaving a rest protruding therefrom, the rest including a slide hole in aside of the rest; and a mount attached to a printed circuit board andhaving a spring slidable into the slide hole with the spring engagingthe hole and pulling the board against the rest locking the boardagainst the rest of the chassis.

The present disclosure also provides a system including a chassis havinga rest protruding therefrom, the rest including a slide hole in a sideof the rest; a mount attached to a printed circuit board and having aspring slidable into the slide hole with the spring engaging the holeand pulling the board against the rest locking the board against therest of the chassis; and a stop on the rest engaging a lock hole in theboard preventing the spring from sliding out of the slide hole.

The present disclosure also provides a system including a chassis havinga rest protruding therefrom, the rest including a slide hole in a sideof the rest; a mount attached to a printed circuit board and having aspring slidable into the slide hole with the spring engaging the holeand pulling the board against the rest locking the board against therest of the chassis; and a chamfer on the spring engaging an edge of thehole resisting the spring to enter the slide hole.

The present disclosure also provides a system including a chassis havinga rest protruding therefrom, the rest including a slide hole in a sideof the rest; a mount attached to a printed circuit board and having aspring slidable into the slide hole with the spring engaging the holeand pulling the board against the rest locking the board against therest of the chassis and having a lead; and an installation hole intowhich the lead extends preventing the spring from sliding out of theslide hole.

The present disclosure also provide a system including a chassis havinga rest protruding therefrom, the rest including a pair of opposingsprings extending from the rest; and a printed circuit board having athrough hole into which the pair of opposing springs are inserted andwhich engages the pair of opposing springs pulling the board against therest locking the board against the rest of the chassis.

The present disclosure also provides a system including a chassis havinga rest protruding therefrom, the rest including a neck and a head; and aprinted circuit board and having hole through which the head extends anda guide in which the neck slides locking the board against the rest ofthe chassis.

The present disclosure also provides a system including a chassis havinga rest protruding therefrom, the rest including a guide protrusion and arotatable latch; and a printed circuit board having hole through whichguide protrusion extends the latch rotatable around a corner of theboard and engaging the protrusion locking the board against the rest ofthe chassis.

The present disclosure also provides a mounting structure, including achassis on which a Printed Circuit Board (PCB) mountable; and a mountingmember fixed on the on the PCB, and configured to slide to fix the PCBon the chassis.

The present disclosure also provides a mounting method, includingpressing a mount of a printed circuit board against a rest protrudingfrom a chassis; and sliding the mount against the rest to engage aspring of the mount with a slide hole of the rest locking the boardagainst the rest of the chassis.

Although a few embodiments of the present disclosure have been shown anddescribed, it would be appreciated by those skilled in the art thatchanges may be made in these embodiments without departing from theprinciples and spirit of the disclosure, the scope of which is definedin the claims and their equivalents.

What is claimed is:
 1. A Printed Circuit Board (PCB) mounting structure,comprising: a chassis on which a plurality of board resting portions aredisposed; a PCB resting on the plurality of board resting portions andincluding an installation hole; a mounting portion disposed on arespective board resting portion of the plurality of board restingportions; and a mounting member including a support portion supported onthe PCB, and a lead protruding from the support portion and inserted inthe installation hole so that the mounting member is thereby fixed onthe PCB, wherein the mounting member is removably coupleable with themounting portion by a sliding movement of the PCB, wherein the mountingportion is bonded on the respective board resting portion andelectrically connected to the respective board resting portion, whereinthe mounting portion comprises a neck connected to the respective boardresting portion, and a head connected to the neck and having across-sectional area wider than a cross-sectional area of the neck,wherein the mounting member and the mounting portion are configured sothat, when the mounting member is coupled with the mounting portion, themounting member is around the neck and below the head, and wherein thechassis, the respective board resting portion, the mounting portion andthe mounting member are each made of a conductive material, and at leastone of the support portion and the lead is bonded to the PCB andelectrically connected to the PCB, so that, when the mounting member iscoupled with the mounting portion, Electro Magnetic Interference (EMI)grounding occurs between the PCB and the chassis through the respectiveboard resting portion, the mounting portion and the mounting member. 2.The PCB mounting structure according to claim 1, wherein the PCBcomprises a first through hole through which the head of the mountingportion passes, and a first guide hole which extends from the firstthrough hole and along which the neck of the mounting portion slides. 3.The PCB mounting structure according to claim 2, wherein the mountingmember comprises a second through hole corresponding to the firstthrough hole, and a second guide hole corresponding to the first guidehole.
 4. The PCB mounting structure according to claim 3, wherein themounting member comprises a pressing portion extending from the supportportion and configured to press at least one of the head and the PCB. 5.The PCB mounting structure according to claim 4, wherein the secondthrough hole is formed in the support portion of the mounting member,and the second guide hole is formed in the pressing portion.
 6. The PCBmounting structure according to claim 5, wherein the pressing portioncomprises an arc structure protruding from the PCB.
 7. The PCB mountingstructure according to claim 6, wherein the mounting portion comprises astopper protruding from the head toward the PCB, and wherein themounting member comprises a stopper accommodating groove formed in a topportion of the arc structure.
 8. The PCB mounting structure according toclaim 5, wherein the second guide hole extends from the second throughhole to a top portion of the mounting member, and wherein when the PCBis mounted, the head presses the arc structure with the pressing portionof the mounting member pressing the PCB.
 9. The PCB mounting structureaccording to claim 6, wherein the second guide hole extends from thesecond through hole to a top portion of the arc structure.
 10. A PrintedCircuit Board (PCB) mounting structure, comprising: a chassis on which aplurality of board resting portions are disposed; a PCB resting on theplurality of board resting portions and including an installation hole;a mounting portion integrated into a respective board resting portion ofthe plurality of board resting portions; and a mounting member includinga support portion supported on the PCB, and a lead protruding from thesupport portion and inserted in the installation hole so that themounting member is thereby fixed on the PCB, wherein the mounting memberis removably coupleable with the mounting portion by a sliding movementof the PCB, wherein the mounting portion is bonded on the respectiveboard resting portion and electrically connected to the respective boardresting portion, wherein the mounting portion comprises a neck connectedto the respective board resting portion, and a head connected to theneck and having a cross-sectional area wider than a cross-sectional areaof the neck, wherein the mounting member and the mounting portion areconfigured so that, when the mounting member is coupled with themounting portion, the mounting member is around the neck and below thehead, and wherein the chassis, the respective board resting portion, themounting portion and the mounting member are each made of a conductivematerial, and at least one of the support portion and the lead is bondedto the PCB and electrically connected to the PCB, so that, when themounting member is coupled with the mounting portion, Electro MagneticInterference (EMI) grounding occurs between the PCB and the chassisthrough the respective board resting portion, the mounting portion andthe mounting member.
 11. A Printed Circuit Board (PCB) mountingstructure, comprising: a chassis on which a plurality of board restingportions are disposed; a PCB resting on the plurality of board restingportions; a mounting portion disposed on a respective board restingportion of the plurality of board resting portions; and a mountingmember fixed on the PCB, and removably coupleable with the mountingportion by a sliding movement of the PCB, wherein the mounting portionis bonded on the respective board resting portion and electricallyconnected to the respective board resting portion, wherein the mountingportion comprises a neck connected to the respective board restingportion, and a head connected to the neck and having a cross-sectionalarea wider than a cross-sectional area of the neck, wherein the mountingportion comprises a stopper protruding from the head toward the PCB, andwherein the mounting member comprises a stopper accommodating grooveformed in a top portion of the arc structure.
 12. A Printed CircuitBoard (PCB) mounting structure, comprising: a chassis on which aplurality of board resting portions are disposed; a PCB resting on theplurality of board resting portions and including an installation hole;a mounting portion disposed on a respective board resting portion of theplurality of board resting portions; and a mounting member including asupport portion supported on the PCB, and a lead protruding from thesupport portion and inserted in the installation hole so that themounting member is thereby fixed on the PCB, wherein the mounting memberis removably coupleable with the mounting portion by a sliding movementof the PCB, wherein the mounting portion is bonded on the respectiveboard resting portion and electrically connected to the respective boardresting portion, wherein the mounting portion comprises a neck connectedto the respective board resting portion, and a head connected to theneck and having a cross-sectional area wider than a cross-sectional areaof the neck, wherein the chassis, the respective board resting portion,the mounting portion and the mounting member are each made of aconductive material, and at least one of the support portion and thelead is bonded to the PCB and electrically connected to the PCB, sothat, when the mounting member is coupled with the mounting portion,Electro Magnetic Interference (EMI) grounding occurs between the PCB andthe chassis through the respective board resting portion, the mountingportion and the mounting member, wherein the PCB comprises a firstthrough hole through which the head of the mounting portion passes, anda first guide hole which extends from the first through hole and alongwhich the neck of the mounting portion slides, wherein the mountingmember comprises a second through hole corresponding to the firstthrough hole, and a second guide hole corresponding to the first guidehole, and wherein the mounting member comprises a pressing portionextending from the support portion and configured to press at least oneof the head and the PCB.
 13. The PCB mounting structure according toclaim 12, wherein the second through hole is formed in the supportportion of the mounting member, and the second guide hole is formed inthe pressing portion.
 14. The PCB mounting structure according to claim13, wherein the pressing portion comprises an arc structure protrudingfrom the PCB.
 15. The PCB mounting structure according to claim 14,wherein the mounting portion comprises a stopper protruding from thehead toward the PCB, and wherein the mounting member comprises a stopperaccommodating groove formed in a top portion of the arc structure. 16.The PCB mounting structure according to claim 13, wherein the secondguide hole extends from the second through hole to a top portion of themounting member, and wherein when the mounting member is coupled withthe mounting portion, the head presses the arc structure with thepressing portion of the mounting member pressing the PCB.
 17. The PCBmounting structure according to claim 14, wherein the second guide holeextends from the second through hole to a top portion of the arcstructure.